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Fingerprint Dive into the research topics where Hideharu Nakashima is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Engineering & Materials Science

Creep
Grain boundaries
Temperature
Transmission electron microscopy
Steel
Microstructure
Strain rate
Bicrystals
Aluminum
Aluminum foil
Textures
Interfacial energy
Residual stresses
Dislocations (crystals)
Indentation
Roll bonding
Hardening
Wire
Fracture toughness
Electron diffraction
Scanning electron microscopy
Solid solutions
Annealing
Strain hardening
Molecular dynamics
Silicon carbide
Recovery
Copper
Single crystals
Atoms
Plastic deformation
Crystal orientation
Ferritic steel
Electrolytic capacitors
Dispersion hardening
Molybdenum
Austenite
Polysilicon
Crack propagation
Electrons
Aging of materials
Stress relaxation
Hydrogen embrittlement
Metal foil
Quenching
Chromium
Sintering
Mechanical properties
Thin films
Plastic flow

Chemical Compounds

Steel
Creep
Grain boundaries
Temperature
Microstructure
Aluminum
Transmission electron microscopy
Strain rate
Bicrystals
Aluminum foil
Textures
Residual stresses
Dislocations (crystals)
Roll bonding
Interfacial energy
Hardening
Copper
Indentation
Molybdenum
Solid solutions
Wire
Strain hardening
Scanning electron microscopy
Fracture toughness
Annealing
Electron diffraction
Recovery
Molecular dynamics
Atoms
Plastic deformation
Electrolytic capacitors
Dispersion hardening
Crack propagation
Polysilicon
Crystal orientation
Aging of materials
Single crystals
Electrons
Ferritic steel
Stress relaxation
Hydrogen embrittlement
Aluminum Oxide
Metal foil
Carbon
Quenching
Sintering
Mechanical properties
Boron
Plastic flow
Crystal atomic structure

Physics & Astronomy

General

grain boundaries
steels
transmission electron microscopy
microstructure
creep tests
bicrystals
hardening
work hardening
purity
thresholds
misalignment
solutes
evaluation
textures
indentation
recovery
atomic structure
insulators
energy
plastics
single crystals
molecular dynamics
thin films
solders
scanning electron microscopy
crystals
exponents
defects
cracks
wafers

Chemistry and Materials

aluminum
surface energy
fracture strength
solid solutions
silicon carbides
wire
copper
molybdenum
silicon
stress relaxation

Physics

strain rate
heat
temperature
strain distribution
atoms
crack propagation

Engineering

residual stress
annealing
heat treatment
fabrication