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Research Output 1983 2020

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Review article
2006

Evalution of drop strength due to thermal degradation for BGA-IC package

Kim, Y. B., Noguchi, H. & Amagai, M., Jan 1 2006, In : Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A. 72, 2, p. 186-191 6 p.

Research output: Contribution to journalReview article

Soldering alloys
Pyrolysis
Impact strength
Copper compounds
Intermetallics