Engineering & Materials Science
Reflection high energy electron diffraction
100%
Electrochemical properties
79%
Growth temperature
69%
Surface structure
68%
Diffraction patterns
61%
Epitaxial films
57%
Transition metals
55%
Cathodes
46%
Permeation
44%
Platinum
44%
Lattice constants
42%
Diffraction
40%
Polyethylenes
39%
Substrates
39%
Impurities
36%
Hysteresis
35%
Relaxation
35%
Ions
34%
Crystallinity
30%
Hydrogen
30%
Dislocations (crystals)
29%
Crystal lattices
29%
Multiple scattering
28%
Polymers
27%
Chemical analysis
24%
Sputtering
24%
Temperature
22%
Energy dissipation
21%
Surface morphology
21%
Thermal desorption
20%
Electric potential
19%
X ray diffraction
18%
Free volume
18%
Hydraulic conductivity
16%
Oxidation-Reduction
16%
Redox reactions
14%
Crystal structure
12%
Lithium
10%
Gas permeability
8%
Hose
8%
Sealants
7%
Density (specific gravity)
7%
Gases
7%
Magnetron sputtering
7%
Networks (circuits)
6%
Atomic force microscopy
6%
Volume fraction
5%
Physical properties
5%
Composite materials
5%
Physics & Astronomy
destruction
37%
spinel
36%
platinum
36%
high energy electrons
35%
plateaus
35%
polyethylenes
33%
electron diffraction
30%
diffraction patterns
25%
impurities
24%
permeability
24%
hydrogen
23%
hydrostatics
20%
diffraction
20%
crystallinity
19%
desorption
16%
oscillations
15%
diffusion coefficient
15%
storage tanks
14%
hoses
14%
sealers
14%
temperature
12%
pressure reduction
11%
lattice parameters
11%
linings
10%
coefficients
10%
sputtering
9%
gases
9%
shrinkage
9%
gas pressure
8%
ions
8%
physical properties
7%
scattering
6%
evaluation
5%
x rays
5%
polymers
5%
Chemical Compounds
Reflection High Energy Electron Diffraction
78%
Surface Structure
55%
Epitaxial Film
53%
Hysteresis
37%
Liquid Film
36%
Misfit Dislocation
34%
Cathode
34%
X-Ray Laue Diffraction
27%
Platinum
27%
Transition Element
27%
Voltage
27%
Strain
26%
Lattice Parameter
18%
Ion
14%
Crystallinity
14%
Open Circuit Potential
14%
Dissipation
13%
Surface
12%
Energy
11%
Lattice Constant
10%
X-Ray Diffraction
9%
Redox Reactions
8%
Twin Boundary
8%
Amount
8%
Sputtering
5%
Reduction
5%