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Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 7 Similar Profiles
Thermal conductivity Engineering & Materials Science
Single-walled carbon nanotubes (SWCN) Engineering & Materials Science
carbon Physics & Astronomy
Carbon Engineering & Materials Science
thermal conductivity Physics & Astronomy
Lasers Engineering & Materials Science
Temperature Engineering & Materials Science
hot surfaces Physics & Astronomy

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Research Output 1997 2019

Measurement of thermal contact resistance between individual carbon fibers using a laser-flash Raman mapping method

Li, Q., Katakami, K., Ikuta, T., Kohno, M., Zhang, X. & Takahashi, K., Jan 1 2019, In : Carbon. 141, p. 92-98 7 p.

Research output: Contribution to journalArticle

Thermal conductivity of solids
Thermal diffusivity
Contact resistance
Heat conduction
Thermal conductivity
Bubbles (in fluids)
Contacts (fluid mechanics)
Boiling liquids

Effect of dissolved gas on bubble growth on a biphilic surface: A diffuse-interface simulation approach

Shen, B., Liu, J., Shiomi, J., Amberg, G., Do-Quang, M., Kohno, M., Takahashi, K. & Takata, Y., Nov 1 2018, In : International Journal of Heat and Mass Transfer. 126, p. 816-829 14 p.

Research output: Contribution to journalArticle

dissolved gases

Effects of hydrogenation on thermal conductivity of ultrananocrystalline diamond/amorphous carbon composite films prepared via coaxial arc plasma deposition

Takeichi, S., Nishiyama, T., Tabara, M., Kawawaki, S., Kohno, M., Takahashi, K. & Yoshitake, T., Jun 1 2018, In : Applied Physics Express. 11, 6, 065101.

Research output: Contribution to journalArticle

Plasma deposition
Carbon films
Amorphous carbon
Composite films
plasma jets

Heat transfer enhancement of a loop thermosyphon with a hydrophobic spot-coated surface

He, H., Shen, B., Chen, L., Hidaka, S., Takahashi, K., Kohno, M. & Takata, Y., Jan 1 2018, In : Journal of Thermal Science and Technology. 13, 1, 17-00620.

Research output: Contribution to journalArticle

heat transfer
Heat transfer