Abstract
A new surface mount technology for over-40-Gb/s ICs has been developed. The technology features 8-mm-square leadless chip carrier packages and four-layer resin printed circuit boards. It was applied to build a prototype InP HFET multichip 1 : 4 DEMUX module, that operates at 45 Gb/s. This technology is promising for small, low-cost IC modules for over-40-Gb/s optical communication systems.
| Translated title of the contribution | Surface Mount Technology for Over-40-Gb/s ICs |
|---|---|
| Original language | Japanese |
| Pages (from-to) | 43-47 |
| Number of pages | 5 |
| Journal | IEICE technical report |
| Volume | 101 |
| Issue number | 555 |
| Publication status | Published - Jan 9 2002 |