2D simulation of FC72 sessile droplet evaporation in the constant contact line region

S. Hussain, Y. Fukatani, Masamichi Kohno, K. Sefiane, Yasuyuki Takata

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A 2-dimensional simulation of FC72 sessile droplet evaporation on a substrate layer consisting of silicon and Kapton tape has been carried out to study the heat and fluid flow inside the droplet as well as its surroundings. The momentum and volume fraction (VOF) equations were solved simultaneously with the heat and diffusion equations to obtain the flow profiles. The simulated conditions were based on actual experiments. This paper presents the findings for the simulated experimental condition for the same substrate and surrounding temperature under a constant contact line condition. The initial conditions for the substrate, surroundings and droplet was set to, as best as possible, the same condition as the experiment. Quantitative as well as qualitative comparisons were made between the experimental and simulated results. The simulation also predicted the temperature and concentration fields inside and outside the evaporating droplet. The predicted temperature and heat transfer profiles were compared to experimental results and were found to be qualitatively agreeable.

Original languageEnglish
Pages (from-to)52-61
Number of pages10
JournalInternational Review of Mechanical Engineering
Volume8
Issue number1
Publication statusPublished - Jan 1 2014

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Contacts (fluid mechanics)
Evaporation
Substrates
Heat transfer
Temperature
Tapes
Flow of fluids
Volume fraction
Momentum
Experiments
Silicon

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

2D simulation of FC72 sessile droplet evaporation in the constant contact line region. / Hussain, S.; Fukatani, Y.; Kohno, Masamichi; Sefiane, K.; Takata, Yasuyuki.

In: International Review of Mechanical Engineering, Vol. 8, No. 1, 01.01.2014, p. 52-61.

Research output: Contribution to journalArticle

@article{f4e6d0ba7d974a94a1afa1b188607f23,
title = "2D simulation of FC72 sessile droplet evaporation in the constant contact line region",
abstract = "A 2-dimensional simulation of FC72 sessile droplet evaporation on a substrate layer consisting of silicon and Kapton tape has been carried out to study the heat and fluid flow inside the droplet as well as its surroundings. The momentum and volume fraction (VOF) equations were solved simultaneously with the heat and diffusion equations to obtain the flow profiles. The simulated conditions were based on actual experiments. This paper presents the findings for the simulated experimental condition for the same substrate and surrounding temperature under a constant contact line condition. The initial conditions for the substrate, surroundings and droplet was set to, as best as possible, the same condition as the experiment. Quantitative as well as qualitative comparisons were made between the experimental and simulated results. The simulation also predicted the temperature and concentration fields inside and outside the evaporating droplet. The predicted temperature and heat transfer profiles were compared to experimental results and were found to be qualitatively agreeable.",
author = "S. Hussain and Y. Fukatani and Masamichi Kohno and K. Sefiane and Yasuyuki Takata",
year = "2014",
month = "1",
day = "1",
language = "English",
volume = "8",
pages = "52--61",
journal = "International Review of Mechanical Engineering",
issn = "1970-8734",
publisher = "Praise Worthy Prize",
number = "1",

}

TY - JOUR

T1 - 2D simulation of FC72 sessile droplet evaporation in the constant contact line region

AU - Hussain, S.

AU - Fukatani, Y.

AU - Kohno, Masamichi

AU - Sefiane, K.

AU - Takata, Yasuyuki

PY - 2014/1/1

Y1 - 2014/1/1

N2 - A 2-dimensional simulation of FC72 sessile droplet evaporation on a substrate layer consisting of silicon and Kapton tape has been carried out to study the heat and fluid flow inside the droplet as well as its surroundings. The momentum and volume fraction (VOF) equations were solved simultaneously with the heat and diffusion equations to obtain the flow profiles. The simulated conditions were based on actual experiments. This paper presents the findings for the simulated experimental condition for the same substrate and surrounding temperature under a constant contact line condition. The initial conditions for the substrate, surroundings and droplet was set to, as best as possible, the same condition as the experiment. Quantitative as well as qualitative comparisons were made between the experimental and simulated results. The simulation also predicted the temperature and concentration fields inside and outside the evaporating droplet. The predicted temperature and heat transfer profiles were compared to experimental results and were found to be qualitatively agreeable.

AB - A 2-dimensional simulation of FC72 sessile droplet evaporation on a substrate layer consisting of silicon and Kapton tape has been carried out to study the heat and fluid flow inside the droplet as well as its surroundings. The momentum and volume fraction (VOF) equations were solved simultaneously with the heat and diffusion equations to obtain the flow profiles. The simulated conditions were based on actual experiments. This paper presents the findings for the simulated experimental condition for the same substrate and surrounding temperature under a constant contact line condition. The initial conditions for the substrate, surroundings and droplet was set to, as best as possible, the same condition as the experiment. Quantitative as well as qualitative comparisons were made between the experimental and simulated results. The simulation also predicted the temperature and concentration fields inside and outside the evaporating droplet. The predicted temperature and heat transfer profiles were compared to experimental results and were found to be qualitatively agreeable.

UR - http://www.scopus.com/inward/record.url?scp=84897893100&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84897893100&partnerID=8YFLogxK

M3 - Article

VL - 8

SP - 52

EP - 61

JO - International Review of Mechanical Engineering

JF - International Review of Mechanical Engineering

SN - 1970-8734

IS - 1

ER -