3D image analysis for evaluating internal deformation / fracture characteristics of materials

Mitsuru Nakazawa, Yoshimitsu Aoki, Yuji Kawai, Masakazu Kobayashi, Hiroyuki Toda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to understand deformation / fracture characteristics, many measurement methods have been proposed and developed. Almost all methods, however, have been limited on the surface indirectly due to insufficient resolution. Recently, third-generation synchrotron radiation facilities have enabled observations with high resolution. Therefore, the 3D mapping of structural features like air bubbles (pores) have been attempted to understand local deformation / fracture characteristics in some materials using the X-ray computed tomography (CT). However, there are some issues and one of them is long processing time. In this paper, we propose a system which can measure a 3D, local, high-accuracy deformation / fracture characteristic by obtaining the strain distribution. Experiments have proved its effectiveness.

Original languageEnglish
Title of host publicationIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
Pages3525-3530
Number of pages6
DOIs
Publication statusPublished - 2006
Externally publishedYes
EventIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics - Paris, France
Duration: Nov 6 2006Nov 10 2006

Other

OtherIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
CountryFrance
CityParis
Period11/6/0611/10/06

Fingerprint

Image analysis
Synchrotron radiation
Tomography
X rays
Processing
Air
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Nakazawa, M., Aoki, Y., Kawai, Y., Kobayashi, M., & Toda, H. (2006). 3D image analysis for evaluating internal deformation / fracture characteristics of materials. In IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics (pp. 3525-3530). [4153571] https://doi.org/10.1109/IECON.2006.347950

3D image analysis for evaluating internal deformation / fracture characteristics of materials. / Nakazawa, Mitsuru; Aoki, Yoshimitsu; Kawai, Yuji; Kobayashi, Masakazu; Toda, Hiroyuki.

IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics. 2006. p. 3525-3530 4153571.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nakazawa, M, Aoki, Y, Kawai, Y, Kobayashi, M & Toda, H 2006, 3D image analysis for evaluating internal deformation / fracture characteristics of materials. in IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics., 4153571, pp. 3525-3530, IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics, Paris, France, 11/6/06. https://doi.org/10.1109/IECON.2006.347950
Nakazawa M, Aoki Y, Kawai Y, Kobayashi M, Toda H. 3D image analysis for evaluating internal deformation / fracture characteristics of materials. In IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics. 2006. p. 3525-3530. 4153571 https://doi.org/10.1109/IECON.2006.347950
Nakazawa, Mitsuru ; Aoki, Yoshimitsu ; Kawai, Yuji ; Kobayashi, Masakazu ; Toda, Hiroyuki. / 3D image analysis for evaluating internal deformation / fracture characteristics of materials. IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics. 2006. pp. 3525-3530
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