3d Imaging for Thermal Cameras Using Structured Light

Jack Erdozain, Kazuto Ichimaru, Tomohiro Maeda, Hiroshi Kawasaki, Ramesh Raskar, Achuta Kadambi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Optical 3D sensing technologies are exploited for many applications in autonomous vehicles, manufacturing, and consumer products. However, existing techniques may suffer in certain challenging conditions, where scattering may occur due to particles. While the light in the visible and near IR spectrum is affected by scattering, long-wave IR (LWIR) tends to experience less scattering, especially when the particles are much smaller than the incident radiation. We propose and demonstrate the expansion of structured light scanning approaches into the LWIR spectrum using a thermal camera and black body radiation source. We then validate the results produced against ground truth scans from traditional structured light scanners. Additional means for projecting these scanning patterns are also discussed alongside potential drawbacks and challenges of this technique associated with future adoption.

Original languageEnglish
Title of host publication2020 IEEE International Conference on Image Processing, ICIP 2020 - Proceedings
PublisherIEEE Computer Society
Pages2795-2799
Number of pages5
ISBN (Electronic)9781728163956
DOIs
Publication statusPublished - Oct 2020
Externally publishedYes
Event2020 IEEE International Conference on Image Processing, ICIP 2020 - Virtual, Abu Dhabi, United Arab Emirates
Duration: Sep 25 2020Sep 28 2020

Publication series

NameProceedings - International Conference on Image Processing, ICIP
Volume2020-October
ISSN (Print)1522-4880

Conference

Conference2020 IEEE International Conference on Image Processing, ICIP 2020
Country/TerritoryUnited Arab Emirates
CityVirtual, Abu Dhabi
Period9/25/209/28/20

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Vision and Pattern Recognition
  • Signal Processing

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