3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM

Kenji Higashida, Masaki Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings of the 25th Risoe International Symposium on Materials Science
Subtitle of host publicationEvolution of Deformation Microstructures in 3D
Pages337-342
Number of pages6
Publication statusPublished - 2004

Cite this

Higashida, K., & Tanaka, M. (2004). 3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM. In Proceedings of the 25th Risoe International Symposium on Materials Science: Evolution of Deformation Microstructures in 3D (pp. 337-342)

3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM. / Higashida, Kenji; Tanaka, Masaki.

Proceedings of the 25th Risoe International Symposium on Materials Science: Evolution of Deformation Microstructures in 3D. 2004. p. 337-342.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Higashida, K & Tanaka, M 2004, 3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM. in Proceedings of the 25th Risoe International Symposium on Materials Science: Evolution of Deformation Microstructures in 3D. pp. 337-342.
Higashida K, Tanaka M. 3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM. In Proceedings of the 25th Risoe International Symposium on Materials Science: Evolution of Deformation Microstructures in 3D. 2004. p. 337-342
Higashida, Kenji ; Tanaka, Masaki. / 3D Structures of Crack-Tip Dislocations in Silicon Revealed by HVEM. Proceedings of the 25th Risoe International Symposium on Materials Science: Evolution of Deformation Microstructures in 3D. 2004. pp. 337-342
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