40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

Y. Miyamoto; M. Yoneyama; Y. Imai; K. Kato; H. Tsunetsugu

doi:10.1049/el:19980337

40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

Y. Miyamoto, M. Yoneyama, Y. Imai, K. Kato, H. Tsunetsugu

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

A 40Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40Gbit/s receiver sensitivity of -23.5dBm was experimentally obtained.

Original language	English
Pages (from-to)	493-494
Number of pages	2
Journal	Electronics Letters
Volume	34
Issue number	5
DOIs	https://doi.org/10.1049/el:19980337
Publication status	Published - Mar 5 1998
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1049/el:19980337

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@article{23a11b45e9764ba491d657704567a4c3,

title = "40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection",

abstract = "A 40Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40Gbit/s receiver sensitivity of -23.5dBm was experimentally obtained.",

author = "Y. Miyamoto and M. Yoneyama and Y. Imai and K. Kato and H. Tsunetsugu",

year = "1998",

month = mar,

day = "5",

doi = "10.1049/el:19980337",

language = "English",

volume = "34",

pages = "493--494",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "Institution of Engineering and Technology",

number = "5",

}

TY - JOUR

T1 - 40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

AU - Miyamoto, Y.

AU - Yoneyama, M.

AU - Imai, Y.

AU - Kato, K.

AU - Tsunetsugu, H.

PY - 1998/3/5

Y1 - 1998/3/5

N2 - A 40Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40Gbit/s receiver sensitivity of -23.5dBm was experimentally obtained.

AB - A 40Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40Gbit/s receiver sensitivity of -23.5dBm was experimentally obtained.

UR - http://www.scopus.com/inward/record.url?scp=0032485143&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032485143&partnerID=8YFLogxK

U2 - 10.1049/el:19980337

DO - 10.1049/el:19980337

M3 - Article

AN - SCOPUS:0032485143

SN - 0013-5194

VL - 34

SP - 493

EP - 494

JO - Electronics Letters

JF - Electronics Letters

IS - 5

ER -

40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

Abstract

All Science Journal Classification (ASJC) codes

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