40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

Y. Miyamoto, M. Yoneyama, Y. Imai, K. Kato, H. Tsunetsugu

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Abstract

A 40Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40Gbit/s receiver sensitivity of -23.5dBm was experimentally obtained.

Original languageEnglish
Pages (from-to)493-494
Number of pages2
JournalElectronics Letters
Volume34
Issue number5
DOIs
Publication statusPublished - Mar 5 1998
Externally publishedYes

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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