48×32 element thermoelectric infrared focal plane array with precisely patterned Au-black absorber

masaki Hirota, F. Satou, M. Saito, S. Morita

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

This paper presents a 48×32 element thermoelectric infrared focal plane array that provides high responsivity and potential for low cost The device has a responsivity of 2100 V/W and a time constant of 25 ms. The overall chip size is 10.5 mm×7.4 mm with a 9.12 mm×6.08 mm imaging area. Each detector consists of six pairs of p-n polysilicon thermocouples, and has external dimensions of 190 μm×190 μm. The processes for obtaining a precisely patterned Au-black infrared absorbing layer and reducing the thermal stress of the Si3N4 layer deposited by LP-CVD achieve both high responsivity and an excellent time constant. This performance is suitable for automotive applications.

Original languageEnglish
Pages (from-to)289-300
Number of pages12
JournalSensors and Materials
Volume12
Issue number5
Publication statusPublished - 2000
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Instrumentation

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