This paper presents a 48×32 element thermoelectric infrared focal plane array that provides high responsivity and potential for low cost The device has a responsivity of 2100 V/W and a time constant of 25 ms. The overall chip size is 10.5 mm×7.4 mm with a 9.12 mm×6.08 mm imaging area. Each detector consists of six pairs of p-n polysilicon thermocouples, and has external dimensions of 190 μm×190 μm. The processes for obtaining a precisely patterned Au-black infrared absorbing layer and reducing the thermal stress of the Si3N4 layer deposited by LP-CVD achieve both high responsivity and an excellent time constant. This performance is suitable for automotive applications.
|Number of pages||12|
|Journal||Sensors and Materials|
|Publication status||Published - 2000|
All Science Journal Classification (ASJC) codes
- Materials Science(all)