600-GHz-band Waveguide-output Uni-traveling-carrier Photodiodes and Their Applications to Wireless Communication

Tadao Nagatsuma, Tsubasa Kurokawa, Masato Sonoda, Tadao Ishibashi, Makoto Shimizu, Kazutoshi Kato

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Uni-traveling-carrier photodiodes (UTC-PDs) are packaged with WR-1.5 rectangular metallic waveguides to ensure 600-GHz band operation. A broadband coupler circuit between the UTC-PD and the hollow waveguide is monolithically integrated with the UTC-PD chip. The fabricated module exhibits the 3-dB bandwidth of 340 GHz, which is the widest among ever-reported photodiode modules. This module is successfully applied to 600-GHz band wireless communications with a data rate of over 10 Gbit/s.

Original languageEnglish
Title of host publicationProceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1180-1183
Number of pages4
ISBN (Print)9781538650677
DOIs
Publication statusPublished - Aug 17 2018
Event2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 - Philadelphia, United States
Duration: Jun 10 2018Jun 15 2018

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2018-June
ISSN (Print)0149-645X

Other

Other2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
CountryUnited States
CityPhiladelphia
Period6/10/186/15/18

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All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Nagatsuma, T., Kurokawa, T., Sonoda, M., Ishibashi, T., Shimizu, M., & Kato, K. (2018). 600-GHz-band Waveguide-output Uni-traveling-carrier Photodiodes and Their Applications to Wireless Communication. In Proceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 (pp. 1180-1183). [8439226] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2018-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2018.8439226