Abstract
To increase bandwidth first, the IC housing structure is investigated using full-wave electromagnetic field simulators. A suitable package is based on the concept of `chip-size-cavity package', by which the parasitic resonance is suppressed and the isolation characteristics between input and output ports are greatly improved. Second, a frequency-de-pendent biasing termination is employed for the drain-line of the amplifier to improve gain degradation at frequencies below 10Ghz. With a package developed for 10Gbps optical transmission systems, fatal degradation of isolation characteristics occurs around 20GHz. The degradation mechanism is analyzed using a full-wave electromagnetic field simulator. This simulator analyzes complex three-dimensional structures and is suited for finding scattering parameters of packages in a wide frequency range. The measured frequency characteristics of the module are shown. Operation is stable with gain flatness within 1.5dB, and 3dB bandwidth of 58GHz. No significant package-induced degradation of return losses is observed. Chip connections are ribbon wires less than 300μm long. Small ripples remain above 25Ghz due to impedance mismatching at the connections. Mismatching could be reduced by using finer connections, such as bumps.
| Original language | English |
|---|---|
| Title of host publication | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
| Editors | Anon |
| Publisher | Publ by IEEE |
| Pages | 180-181 |
| Number of pages | 2 |
| ISBN (Print) | 0780318455 |
| Publication status | Published - Jan 1 1994 |
| Externally published | Yes |
| Event | Proceedings of the 1994 IEEE International Solid-State Circuits Conference - San Francisco, CA, USA Duration: Feb 16 1994 → Feb 18 1994 |
Publication series
| Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
|---|
Other
| Other | Proceedings of the 1994 IEEE International Solid-State Circuits Conference |
|---|---|
| City | San Francisco, CA, USA |
| Period | 2/16/94 → 2/18/94 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
Cite this
60GHz-bandwidth distributed baseband amplifier IC in a package optimized for isolation. / Shibata, Tsugumichi; Kimura, Shunji; Kimura, Hideaki; Imai, Yuhki; Umeda, Uohtaro; Akazawa, Yukio.
Digest of Technical Papers - IEEE International Solid-State Circuits Conference. ed. / Anon. Publ by IEEE, 1994. p. 180-181 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - 60GHz-bandwidth distributed baseband amplifier IC in a package optimized for isolation
AU - Shibata, Tsugumichi
AU - Kimura, Shunji
AU - Kimura, Hideaki
AU - Imai, Yuhki
AU - Umeda, Uohtaro
AU - Akazawa, Yukio
PY - 1994/1/1
Y1 - 1994/1/1
N2 - To increase bandwidth first, the IC housing structure is investigated using full-wave electromagnetic field simulators. A suitable package is based on the concept of `chip-size-cavity package', by which the parasitic resonance is suppressed and the isolation characteristics between input and output ports are greatly improved. Second, a frequency-de-pendent biasing termination is employed for the drain-line of the amplifier to improve gain degradation at frequencies below 10Ghz. With a package developed for 10Gbps optical transmission systems, fatal degradation of isolation characteristics occurs around 20GHz. The degradation mechanism is analyzed using a full-wave electromagnetic field simulator. This simulator analyzes complex three-dimensional structures and is suited for finding scattering parameters of packages in a wide frequency range. The measured frequency characteristics of the module are shown. Operation is stable with gain flatness within 1.5dB, and 3dB bandwidth of 58GHz. No significant package-induced degradation of return losses is observed. Chip connections are ribbon wires less than 300μm long. Small ripples remain above 25Ghz due to impedance mismatching at the connections. Mismatching could be reduced by using finer connections, such as bumps.
AB - To increase bandwidth first, the IC housing structure is investigated using full-wave electromagnetic field simulators. A suitable package is based on the concept of `chip-size-cavity package', by which the parasitic resonance is suppressed and the isolation characteristics between input and output ports are greatly improved. Second, a frequency-de-pendent biasing termination is employed for the drain-line of the amplifier to improve gain degradation at frequencies below 10Ghz. With a package developed for 10Gbps optical transmission systems, fatal degradation of isolation characteristics occurs around 20GHz. The degradation mechanism is analyzed using a full-wave electromagnetic field simulator. This simulator analyzes complex three-dimensional structures and is suited for finding scattering parameters of packages in a wide frequency range. The measured frequency characteristics of the module are shown. Operation is stable with gain flatness within 1.5dB, and 3dB bandwidth of 58GHz. No significant package-induced degradation of return losses is observed. Chip connections are ribbon wires less than 300μm long. Small ripples remain above 25Ghz due to impedance mismatching at the connections. Mismatching could be reduced by using finer connections, such as bumps.
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M3 - Conference contribution
AN - SCOPUS:0028060885
SN - 0780318455
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 180
EP - 181
BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
A2 - Anon, null
PB - Publ by IEEE
ER -