Bingham semi solid/fluid isostatic pressing (BIP) was developed recently by the authors. Advantages of this method are as follows: cracks in molded products that are likely to occur because of the mold's springback during unloading can be avoided; the density is almost uniform in molded products. On the other hand, it is not easy to form the mold of a complicated structure by wax or the Bingham semi solid/fluid, which is of a small yield stress. Therefore, wax with a higher yield stress is needed However, this easily induces cracks in the mold itself as well as the molded products. In this research, therefore, a new process named temperature controlled BIP is developed, and the characteristics of this new process are discussed. In this process, we first form a mold by wax of a higher yield stress, and we then raise the temperature of the mold to decrease its yield stress before pressing. We liquefy the mold completely by controlling the temperature before unloading and take out the compact successfully.