A large, freestanding, 20 nm thick nanomembrane based on an epoxy resin

Hirohmi Watanabe, Toyoki Kunitake

Research output: Contribution to journalArticle

47 Citations (Scopus)

Abstract

A highly crosslinked organic polymer that does not rely on an Interpenetrating polymer network (IPN) structure was investigated. a sacrificial layer of poly(4-hydroxystyrene) (PHS) was spin-coated to a thickness of 0.1 μm on a flat substrate. The crosslinking was monitored by using attenuated total reflectance Fourier transform IR spectroscopy. The 20 nm thick nanomembrane was transferred to a wire frame 1 cm in diameter. The epoxy nanomembranes were transferred onto anodized aluminum oxide (AAO) membranes for scanning electron microscopy (SEM) measurements. The electrical properties of the nanomembranes were studied on a p-type silicon wafer by using a potentiostat/galvanostat system. It was observed that the epoxy resin is highly compatible with many chemical substances and the behavior can be used to develop superior or functional and structural composites.

Original languageEnglish
Pages (from-to)909-912
Number of pages4
JournalAdvanced Materials
Volume19
Issue number7
DOIs
Publication statusPublished - Apr 6 2007
Externally publishedYes

Fingerprint

Epoxy Resins
Interpenetrating polymer networks
Organic polymers
Aluminum Oxide
Silicon wafers
Epoxy resins
Crosslinking
Infrared spectroscopy
Fourier transforms
Electric properties
Wire
Membranes
Aluminum
Scanning electron microscopy
Oxides
Composite materials
Substrates
4-vinylphenol

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

A large, freestanding, 20 nm thick nanomembrane based on an epoxy resin. / Watanabe, Hirohmi; Kunitake, Toyoki.

In: Advanced Materials, Vol. 19, No. 7, 06.04.2007, p. 909-912.

Research output: Contribution to journalArticle

Watanabe, Hirohmi ; Kunitake, Toyoki. / A large, freestanding, 20 nm thick nanomembrane based on an epoxy resin. In: Advanced Materials. 2007 ; Vol. 19, No. 7. pp. 909-912.
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