A large number of I/O connections using compliant bump

Naoya Watanabe, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

We demonstrate a large number of I/O connections (number of bumps: 10,000, size/pitch: 10 μm/20 μm) using the compliant bump. The bump connection test was carried out by using not only daisy chain but also active-matrix switch array. These tests revealed that the compliant bump suppresses the bonding failure. We also demonstrate that the compliant bump is very effective in reducing the change in characteristic of MOSFET even when bump bonding is performed directly on the MOSFET.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages125-130
Number of pages6
Volume2006
DOIs
Publication statusPublished - 2006
Externally publishedYes
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: May 30 2006Jun 2 2006

Other

OtherIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period5/30/066/2/06

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Watanabe, N., & Asano, T. (2006). A large number of I/O connections using compliant bump. In Proceedings - IEEE 56th Electronic Components and Technology Conference (Vol. 2006, pp. 125-130). [1645635] https://doi.org/10.1109/ECTC.2006.1645635