Abstract
The damage evolution in Bi2223 filaments and its influence on critical current was described by a Monte Carlo-shear lag simulation method. The experimentally observed zigzag crack propagation across aligned Bi2223 grains under tensile strain was effectively modelled by including transverse and longitudinal failure modes for individual grains. From the simulated stress-strain curve, the survival parameter (slope of the stress-strain curve normalized with respect to the original Young's modulus) was estimated with increasing applied strain. With this parameter combined with the strain sensitivity of the critical current, the measured change of critical current of the composite tape with applied strain could be described well.
Original language | English |
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Pages (from-to) | S232-S240 |
Journal | Superconductor Science and Technology |
Volume | 18 |
Issue number | 12 |
DOIs | |
Publication status | Published - Dec 1 2005 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Condensed Matter Physics
- Metals and Alloys
- Electrical and Electronic Engineering
- Materials Chemistry