A new constitutive relationship for the homogeneous deformation of metals over a wide range of strain

Nguyen Q. Chinh, Gyozo Horváth, Zenji Horita, Terence G. Langdon

Research output: Contribution to journalArticle

116 Citations (Scopus)

Abstract

The stress-strain relationships of high-purity aluminum and copper were investigated over a wide range of strain by combining data obtained in the conventional tensile and compression testing of annealed samples with data obtained after processing by equal-channel angular pressing (ECAP) to high imposed strains. The true stress-true strain curves were analyzed mathematically taking the absolute strain as zero for the annealed condition and equal to the strain imposed through ECAP for the as-pressed samples. It is shown that, over the entire range of strain inherent in these experiments, the macroscopic stress-strain behavior of Al and Cu may be represented by an exponential power-law constitutive relationship which reduces to the conventional Hollomon power-law relationship at low strains and to the Voce exponential relationship at high strains. It is demonstrated that the results obtained from tensile or compressive testing to low strains at room temperature are sufficient, when used with the new constitutive relationship, to provide detailed information on the nature of the stress-strain behavior to high strains. The validity of the new relationship is supported by theoretical considerations which incorporate the major micro-mechanisms of plastic deformation.

Original languageEnglish
Pages (from-to)3555-3563
Number of pages9
JournalActa Materialia
Volume52
Issue number12
DOIs
Publication statusPublished - Jul 12 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Fingerprint Dive into the research topics of 'A new constitutive relationship for the homogeneous deformation of metals over a wide range of strain'. Together they form a unique fingerprint.

  • Cite this