A new phase in stoichiometric Cu 6Sn 5

Y. Q. Wu, J. C. Barry, T. Yamamoto, Q. F. Gu, S. D. McDonald, S. Matsumura, H. Huang, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

37 Citations (Scopus)

Abstract

The intermetallic compound Cu 6Sn 5 is a significant microstructural feature of many electronic devices where it is present at the solder-substrate interfaces. The time- and temperature-dependent thermomechanical properties of Cu 6Sn 5 are dependent on the nature and stability of its crystal structure, which has been shown to exist in at least four variants (η, η', η 6 and η 8). This research details an additional newly identified monoclinic-based structure in directly alloyed stoichiometric Cu 6Sn 5 using variable-temperature synchrotron X-ray diffraction (XRD) and transmission electron microscopy. The phase is associated with a departure from the equilibrium temperature of the polymorphic monoclinic-hexagonal transformation temperature. The new monoclinic phase can be treated as a modulation of four η 8-Cu 5Sn 4 unit cells plus one η'-Cu 6Sn 5 unit cell. It has been labeled as η 4+1 and has cell parameters of a = 92.241 Å, b = 7.311 Å, c = 9.880 Å and β = 118.95° determined from electron diffraction patterns. The XRD results could be fitted well to a Rietveld refinement using the new crystal parameters.

Original languageEnglish
Pages (from-to)6581-6591
Number of pages11
JournalActa Materialia
Volume60
Issue number19
DOIs
Publication statusPublished - Nov 1 2012

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Fingerprint Dive into the research topics of 'A new phase in stoichiometric Cu <sub>6</sub>Sn <sub>5</sub>'. Together they form a unique fingerprint.

Cite this