A new phase in stoichiometric Cu 6Sn 5

Y. Q. Wu, J. C. Barry, T. Yamamoto, Q. F. Gu, S. D. McDonald, S. Matsumura, H. Huang, K. Nogita

Research output: Contribution to journalArticle

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Abstract

The intermetallic compound Cu 6Sn 5 is a significant microstructural feature of many electronic devices where it is present at the solder-substrate interfaces. The time- and temperature-dependent thermomechanical properties of Cu 6Sn 5 are dependent on the nature and stability of its crystal structure, which has been shown to exist in at least four variants (η, η', η 6 and η 8). This research details an additional newly identified monoclinic-based structure in directly alloyed stoichiometric Cu 6Sn 5 using variable-temperature synchrotron X-ray diffraction (XRD) and transmission electron microscopy. The phase is associated with a departure from the equilibrium temperature of the polymorphic monoclinic-hexagonal transformation temperature. The new monoclinic phase can be treated as a modulation of four η 8-Cu 5Sn 4 unit cells plus one η'-Cu 6Sn 5 unit cell. It has been labeled as η 4+1 and has cell parameters of a = 92.241 Å, b = 7.311 Å, c = 9.880 Å and β = 118.95° determined from electron diffraction patterns. The XRD results could be fitted well to a Rietveld refinement using the new crystal parameters.

Original languageEnglish
Pages (from-to)6581-6591
Number of pages11
JournalActa Materialia
Volume60
Issue number19
DOIs
Publication statusPublished - Nov 1 2012

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X ray diffraction
Temperature
Rietveld refinement
Synchrotrons
Electron diffraction
Soldering alloys
Diffraction patterns
Intermetallics
Crystal structure
Modulation
Transmission electron microscopy
Crystals
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Cite this

Wu, Y. Q., Barry, J. C., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., ... Nogita, K. (2012). A new phase in stoichiometric Cu 6Sn 5 Acta Materialia, 60(19), 6581-6591. https://doi.org/10.1016/j.actamat.2012.08.024

A new phase in stoichiometric Cu 6Sn 5 . / Wu, Y. Q.; Barry, J. C.; Yamamoto, T.; Gu, Q. F.; McDonald, S. D.; Matsumura, S.; Huang, H.; Nogita, K.

In: Acta Materialia, Vol. 60, No. 19, 01.11.2012, p. 6581-6591.

Research output: Contribution to journalArticle

Wu, YQ, Barry, JC, Yamamoto, T, Gu, QF, McDonald, SD, Matsumura, S, Huang, H & Nogita, K 2012, 'A new phase in stoichiometric Cu 6Sn 5 ', Acta Materialia, vol. 60, no. 19, pp. 6581-6591. https://doi.org/10.1016/j.actamat.2012.08.024
Wu YQ, Barry JC, Yamamoto T, Gu QF, McDonald SD, Matsumura S et al. A new phase in stoichiometric Cu 6Sn 5 Acta Materialia. 2012 Nov 1;60(19):6581-6591. https://doi.org/10.1016/j.actamat.2012.08.024
Wu, Y. Q. ; Barry, J. C. ; Yamamoto, T. ; Gu, Q. F. ; McDonald, S. D. ; Matsumura, S. ; Huang, H. ; Nogita, K. / A new phase in stoichiometric Cu 6Sn 5 In: Acta Materialia. 2012 ; Vol. 60, No. 19. pp. 6581-6591.
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