A novel CMP process using the size-controllable polyhydroxylated fullerene cluster

H. Tachika, Y. Takaya, T. Hayashi, K. Kokubo, K. Suzuki, K. Shirai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We proposed a novel CMP process by using the poly-hydroxylated fullerene ( C60(OH)36 ). It is previously reported that the copper surface was improved from 16.5 nm RMS to 1 nm RMS using the C60(OH)36 molecule as an abrasive grain. However, the polishing rate is the drawback. Then, in this paper, the polishing rate was controlled using the size-controllable C60(OH)36 cluster from 1 to 200 nm by the UV laser irradiation. Consequently, the higher polishing rate (Max 300 nm/min) is achieved.

Original languageEnglish
Title of host publicationProceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
EditorsHendrik Van Brussel, E. Brinksmeier, H. Spaan, T. Burke
Publishereuspen
Pages460-464
Number of pages5
ISBN (Electronic)9780955308253
Publication statusPublished - 2008
Externally publishedYes
Event10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008 - Zurich, Switzerland
Duration: May 18 2008May 22 2008

Publication series

NameProceedings of the 10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
Volume2

Other

Other10th Anniversary International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2008
CountrySwitzerland
CityZurich
Period5/18/085/22/08

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Mechanical Engineering
  • Materials Science(all)
  • Environmental Engineering
  • Industrial and Manufacturing Engineering

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