A novel surface finishing technique for microparts using an optically controlled microparticle tool

Y. Takaya, K. Hida, T. Miyoshi, Terutake Hayashi

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This paper focuses on the surface finishing of a micropart made of single-crystal silicon. First, polishing experiments for a rough silicon surface are performed using an optically controlled silica particle with a diameter of 5 μm as a microparticle tool. The root mean square roughness (Rq) of the finished surface in the processed area is 23.2 nm, which is less than the initial surface roughness of 27.1 nm Rq. The fine polishing of a Si wafer specimen with an initial surface roughness of 4.3 nm Rq is then conducted using a silica particle with a diameter of 3 μm. Subsequently, a reference position detection method is introduced. The experimental results reveal that the surface roughness with a spatial wavelength ranging from 1 μm to 10 nm, over an area of several square micrometers, can be improved to the order of nanometers.

Original languageEnglish
Pages (from-to)613-616
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume55
Issue number1
DOIs
Publication statusPublished - Jan 1 2006
Externally publishedYes

Fingerprint

Surface roughness
Polishing
Silica
Silicon
Single crystals
Wavelength
Experiments

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

A novel surface finishing technique for microparts using an optically controlled microparticle tool. / Takaya, Y.; Hida, K.; Miyoshi, T.; Hayashi, Terutake.

In: CIRP Annals - Manufacturing Technology, Vol. 55, No. 1, 01.01.2006, p. 613-616.

Research output: Contribution to journalArticle

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