A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

C. M. Gourlay, K. Nogita, S. D. McDonald, T. Nishimura, K. Sweatman, A. K. Dahle

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19 Citations (Scopus)

Abstract

The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni.

Original languageEnglish
Pages (from-to)1557-1562
Number of pages6
JournalScripta Materialia
Volume54
Issue number9
DOIs
Publication statusPublished - May 1 2006

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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