TY - GEN
T1 - A Soft Wearable Robotic Suit for Ankle and Hip Assistance
T2 - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
AU - Jin, Shanhai
AU - Guo, Shijie
AU - Hashimoto, Kazunobu
AU - Xiong, Xiaogang
AU - Yamamoto, Motoji
N1 - Funding Information:
This work was supported by Grant-in-Aid for the Adaptable & Seamless Technology Transfer program through Target driven R&D (AS2415010K) from Japan Science and Technology Agency (JST), and Shenzhen Peacock Technical Innovation Funding (KQJSCX20170726103546683).
PY - 2018/10/26
Y1 - 2018/10/26
N2 - As a walking assistive device, one of major goals should be reduce wearer's metabolic cost as much as possible. Toward this goal, this paper presents the preliminary study on a new soft wearable robotic suit for ankle and hip assistance for daily life activities. The presented robotic suit is lightweight, and it almost does not restrict the lower limb motion range. In addition, its structure is simple, and thus wearers can easily take the device on and off by themselves. Experimental results on two young subjects show that the robotic suit reduced metabolic cost with averaged reductions of 10.2 % and 6.8 %, respectively, by not drastically disrupting the normal walking biomechanics of the subjects.
AB - As a walking assistive device, one of major goals should be reduce wearer's metabolic cost as much as possible. Toward this goal, this paper presents the preliminary study on a new soft wearable robotic suit for ankle and hip assistance for daily life activities. The presented robotic suit is lightweight, and it almost does not restrict the lower limb motion range. In addition, its structure is simple, and thus wearers can easily take the device on and off by themselves. Experimental results on two young subjects show that the robotic suit reduced metabolic cost with averaged reductions of 10.2 % and 6.8 %, respectively, by not drastically disrupting the normal walking biomechanics of the subjects.
UR - http://www.scopus.com/inward/record.url?scp=85056594939&partnerID=8YFLogxK
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U2 - 10.1109/EMBC.2018.8512599
DO - 10.1109/EMBC.2018.8512599
M3 - Conference contribution
C2 - 30440760
AN - SCOPUS:85056594939
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 1867
EP - 1870
BT - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 July 2018 through 21 July 2018
ER -