A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials

Hiroshi Takamatsu, Syamsul Hadi, Mamoru Nishitani, Takanobu Fukunaga, Kosaku Kurata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationThird International Forum on Heat Transfer
Publication statusPublished - Nov 2012

Cite this

Takamatsu, H., Hadi, S., Nishitani, M., Fukunaga, T., & Kurata, K. (2012). A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials. In Third International Forum on Heat Transfer

A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials. / Takamatsu, Hiroshi; Hadi, Syamsul; Nishitani, Mamoru; Fukunaga, Takanobu; Kurata, Kosaku.

Third International Forum on Heat Transfer. 2012.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takamatsu, H, Hadi, S, Nishitani, M, Fukunaga, T & Kurata, K 2012, A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials. in Third International Forum on Heat Transfer.
Takamatsu H, Hadi S, Nishitani M, Fukunaga T, Kurata K. A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials. In Third International Forum on Heat Transfer. 2012
Takamatsu, Hiroshi ; Hadi, Syamsul ; Nishitani, Mamoru ; Fukunaga, Takanobu ; Kurata, Kosaku. / A stamp sensor for measurement of thermal conductivity and thermal diffusivity of solid materials. Third International Forum on Heat Transfer. 2012.
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