A study for thermal development of PMMA after SR exposure using GPC

Tsuyoshi Fujimura, Yukinori Kuroki, Akihiro Ikeda, Reiji Hattori, Suk Sang Chang

Research output: Contribution to journalArticle

Abstract

Mask pattern image is engraved into polymethylmethacrylate (PMMA) film after SR light irradiation, and additional thermal treatment makes it deeper. PMMA molecular weight distribution was measured by using gel permeation chromatography (GPC) after each process. GPC measurement showed that PMMA molecular weight became lower after SR exposure, and lower PMMA molecules than M.W. 7,000 disappeared from the film thoroughly after thermal development at 135°C in vacuum. Comparing the density measured by microbalance with the refractive index by elipsometry, the change of molecular composition in PMMA might occur by SR irradiation.

Original languageEnglish
Pages (from-to)134-135
Number of pages2
JournalResearch Reports on Information Science and Electrical Engineering of Kyushu University
Volume6
Issue number1
Publication statusPublished - 2001
Externally publishedYes

Fingerprint

Gel permeation chromatography
Irradiation
Molecular weight distribution
Masks
Refractive index
Molecular weight
Heat treatment
Vacuum
Molecules
Chemical analysis
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Hardware and Architecture
  • Engineering (miscellaneous)

Cite this

A study for thermal development of PMMA after SR exposure using GPC. / Fujimura, Tsuyoshi; Kuroki, Yukinori; Ikeda, Akihiro; Hattori, Reiji; Chang, Suk Sang.

In: Research Reports on Information Science and Electrical Engineering of Kyushu University, Vol. 6, No. 1, 2001, p. 134-135.

Research output: Contribution to journalArticle

Fujimura, Tsuyoshi ; Kuroki, Yukinori ; Ikeda, Akihiro ; Hattori, Reiji ; Chang, Suk Sang. / A study for thermal development of PMMA after SR exposure using GPC. In: Research Reports on Information Science and Electrical Engineering of Kyushu University. 2001 ; Vol. 6, No. 1. pp. 134-135.
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