A study of the reliability of mosfets in two stacked thin chips for 3D system in package

Akihiro Ikeda, Yosuke Sugimoto, Tomonori Kuwada, Satoru Kajiwara, Tsuyoshi Fujimura, Kazuya Iwasaki, Hiroshi Ogi, Kiyoshi Hamaguchi, Hisao Kuriyaki, Reiji Hattori, Yukinori Kuroki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
Original languageEnglish
Title of host publication2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual
Pages578-579
Number of pages2
Publication statusPublished - Dec 15 2005
Event2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual - San Jose, CA, United States
Duration: Apr 17 2005Apr 21 2005

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Other

Other2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual
CountryUnited States
CitySan Jose, CA
Period4/17/054/21/05

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Ikeda, A., Sugimoto, Y., Kuwada, T., Kajiwara, S., Fujimura, T., Iwasaki, K., Ogi, H., Hamaguchi, K., Kuriyaki, H., Hattori, R., & Kuroki, Y. (2005). A study of the reliability of mosfets in two stacked thin chips for 3D system in package. In 2005 IEEE International Reliability Physics Symposium Proceedings, 43rd Annual (pp. 578-579). (IEEE International Reliability Physics Symposium Proceedings).