A Study on flow boiling heat transfer in non-uniformly heated parallel mini-channels by numerical analysis

Kizuku Kurose, Takuya Kawasuso, Kazushi Miyata, Yoshinori Hamamoto, Hideo Mori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel heat exchanger using parallel refrigerant mini-channels has recently been developed to improve the performance of air conditioning systems. In the evaporator, due to unequal heat load among the parallel channels, boiling flow tends to be unevenly distributed. Since this phenomenon sometimes causes deterioration of heat exchange performance, it is important to clarify the characteristics of boiling heat transfer under the unequally heated condition. In the present study, a simulation model which predicts flow boiling heat transfer performance of a refrigerant heated unequally among parallel mini-channels has been developed, and simulation for two-parallel channels were carried out. Based on the calculation results, the effect of the inequality in wall temperatures between the channels on the heat transfer rate to the refrigerant was discussed. The channel mean heat transfer rate decreased with expanding the difference of wall temperatures between the channels and the deterioration rate became significant at a high mass flow velocity.

Original languageEnglish
Title of host publicationICR 2019 - 25th IIR International Congress of Refrigeration
EditorsVasile Minea
PublisherInternational Institute of Refrigeration
Pages2431-2438
Number of pages8
ISBN (Electronic)9782362150357
DOIs
Publication statusPublished - 2019
Event25th IIR International Congress of Refrigeration, ICR 2019 - Montreal, Canada
Duration: Aug 24 2019Aug 30 2019

Publication series

NameRefrigeration Science and Technology
Volume2019-August
ISSN (Print)0151-1637

Conference

Conference25th IIR International Congress of Refrigeration, ICR 2019
Country/TerritoryCanada
CityMontreal
Period8/24/198/30/19

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics

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