A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip

Takao Nagasaki, Kazuyoshi Fushinobu, Kunio Hijikata, Ryo Kurazume

Research output: Contribution to journalArticle

Abstract

Heat transfer from small heating elements on a substrate has been studied experimentally and analytically. In one of the experiments, the heating elements are diodes in an actual IC chip. In another set of experiments, heaters are small thin films deposited on a glass plate. In both experiments, the substrates are cooled by an impinging jet of air or channel flow. The experimental data indicate that heat conduction from the heating element to the substrate is an important factor in the determination of the maximum temperature of the element, while the surface heat transfer determines the bulk temperature of the chip. The numerical analysis clarifies that a chip surface with an area much larger than the element size is necessary for the heat transfer to the air flow.

Original languageEnglish
Pages (from-to)2234-2240
Number of pages7
JournalNihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Volume58
Issue number551
DOIs
Publication statusPublished - Jan 1 1992
Externally publishedYes

Fingerprint

Electric heating elements
integrated circuits
Integrated circuits
heat transfer
chips
air flow
Heat transfer
heating
Substrates
Experiments
channel flow
Channel flow
Air
heaters
Heat conduction
conductive heat transfer
numerical analysis
Numerical analysis
Diodes
diodes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering

Cite this

A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip. / Nagasaki, Takao; Fushinobu, Kazuyoshi; Hijikata, Kunio; Kurazume, Ryo.

In: Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B, Vol. 58, No. 551, 01.01.1992, p. 2234-2240.

Research output: Contribution to journalArticle

@article{d5392e688bcc45d39d88333705750852,
title = "A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip",
abstract = "Heat transfer from small heating elements on a substrate has been studied experimentally and analytically. In one of the experiments, the heating elements are diodes in an actual IC chip. In another set of experiments, heaters are small thin films deposited on a glass plate. In both experiments, the substrates are cooled by an impinging jet of air or channel flow. The experimental data indicate that heat conduction from the heating element to the substrate is an important factor in the determination of the maximum temperature of the element, while the surface heat transfer determines the bulk temperature of the chip. The numerical analysis clarifies that a chip surface with an area much larger than the element size is necessary for the heat transfer to the air flow.",
author = "Takao Nagasaki and Kazuyoshi Fushinobu and Kunio Hijikata and Ryo Kurazume",
year = "1992",
month = "1",
day = "1",
doi = "10.1299/kikaib.58.2234",
language = "English",
volume = "58",
pages = "2234--2240",
journal = "Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B",
issn = "0387-5016",
publisher = "The Japan Society of Mechanical Engineers",
number = "551",

}

TY - JOUR

T1 - A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip

AU - Nagasaki, Takao

AU - Fushinobu, Kazuyoshi

AU - Hijikata, Kunio

AU - Kurazume, Ryo

PY - 1992/1/1

Y1 - 1992/1/1

N2 - Heat transfer from small heating elements on a substrate has been studied experimentally and analytically. In one of the experiments, the heating elements are diodes in an actual IC chip. In another set of experiments, heaters are small thin films deposited on a glass plate. In both experiments, the substrates are cooled by an impinging jet of air or channel flow. The experimental data indicate that heat conduction from the heating element to the substrate is an important factor in the determination of the maximum temperature of the element, while the surface heat transfer determines the bulk temperature of the chip. The numerical analysis clarifies that a chip surface with an area much larger than the element size is necessary for the heat transfer to the air flow.

AB - Heat transfer from small heating elements on a substrate has been studied experimentally and analytically. In one of the experiments, the heating elements are diodes in an actual IC chip. In another set of experiments, heaters are small thin films deposited on a glass plate. In both experiments, the substrates are cooled by an impinging jet of air or channel flow. The experimental data indicate that heat conduction from the heating element to the substrate is an important factor in the determination of the maximum temperature of the element, while the surface heat transfer determines the bulk temperature of the chip. The numerical analysis clarifies that a chip surface with an area much larger than the element size is necessary for the heat transfer to the air flow.

UR - http://www.scopus.com/inward/record.url?scp=85024317795&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85024317795&partnerID=8YFLogxK

U2 - 10.1299/kikaib.58.2234

DO - 10.1299/kikaib.58.2234

M3 - Article

AN - SCOPUS:85024317795

VL - 58

SP - 2234

EP - 2240

JO - Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B

JF - Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B

SN - 0387-5016

IS - 551

ER -