A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo, S. Ohtsuka, T. Arakawa, T. Izumi, S. Shoji, H. Sato, H. Kobayashi, K. Mori, T. Homma, T. Osaka, K. Mitsuda, N. Y. Yamasaki, R. Fujimoto, N. Iyomoto, T. Oshima, K. Futamoto, Y. Takei, T. Ichitsubo, T. Fujimori, Y. IshisakiU. Morita, T. Koga, K. Sato, T. Ohashi, Y. Kuroda, M. Onishi, K. Otake

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages182-183
Number of pages2
ISBN (Electronic)4891140402, 9784891140403
DOIs
Publication statusPublished - Jan 1 2003
Externally publishedYes
EventInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
Duration: Oct 29 2003Oct 31 2003

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2003
CountryJapan
CityTokyo
Period10/29/0310/31/03

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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