AC loss characteristics of Bi-2212 multifilamentary round wires and their cables

K. Funaki, M. Iwakuma, K. Kajikawa, N. Hirano, S. Nagaya, N. Ohtani, T. Hasegawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The AC losses of Bi-2212 multifilamentary round wires and the Rutherford-type cables were measured in transverse AC magnetic fields at liquid helium temperature by means of a standard pickup-coil method. The AC losses obtained for the strands were scarcely dependent upon the frequency of the external field in the range from 0.02 Hz to 10 Hz. This suggested that the hysteresis loss in a tightly coupled filament bundle be dominant. A remarkable improvement in the AC loss characteristic by reducing an effective diameter of the filament bundle are observed, while twisting the filaments itself does not contribute to the reduction in the AC loss. It was also found from the comparison between the AC losses in the strands and the cables that the AC losses in the cables mainly came from the individual strands.

Original languageEnglish
Title of host publicationProceedings of the Twentieth International Cryogenic Engineering Conference, ICEC 20
PublisherElsevier
Pages499-502
Number of pages4
ISBN (Print)0080445594, 9780080445595
DOIs
Publication statusPublished - 2005
EventTwentieth International Cryogenic Engineering Conference, ICEC 20 - Beijing, China
Duration: May 11 2004May 14 2004

Publication series

NameProceedings of the Twentieth International Cryogenic Engineering Conference, ICEC 20

Other

OtherTwentieth International Cryogenic Engineering Conference, ICEC 20
CountryChina
CityBeijing
Period5/11/045/14/04

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Funaki, K., Iwakuma, M., Kajikawa, K., Hirano, N., Nagaya, S., Ohtani, N., & Hasegawa, T. (2005). AC loss characteristics of Bi-2212 multifilamentary round wires and their cables. In Proceedings of the Twentieth International Cryogenic Engineering Conference, ICEC 20 (pp. 499-502). (Proceedings of the Twentieth International Cryogenic Engineering Conference, ICEC 20). Elsevier. https://doi.org/10.1016/b978-008044559-5/50117-4