Advanced integrated cooling systems for thermal management in data centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken Ichi Iimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

For a drastic energy conservation in data centers (more than 30%), a new advanced concept of thermal management systems of integrated cooling network in server racks is proposed, and a series of developmental studies toward the realization of the concept have been conducted. The concept consists of the following technological items: - Plug-in thermal network cables, - Narrow channel heat exchangers (single-phase and two-phase), - Thin flat-type heat pipes, - Development of nano-fluids for heat transfer enhancement. In this concept, CPUs in server racks are directly cooled with the aid of advanced 1.5 mm thick flat-type heat pipes or 3 mm thick narrow channel heat exchangers, though CPUs in server racks, at present, are cooled down with massive heat sinks by forced air flow in the racks. In the case of heat pipes, condensation regions are cooled by either single-phase or two-phase narrow channel heat sink instead of air-cooled finned heat sink. These cooling units are accommodated in server racks. In addition, plug-in thermal network cables, in which a working fluid for narrow channel heat exchangers is running, are integrated among server racks, and thermal energy dissipated in server racks are inclusively merged and managed by the thermal network cables. The working fluid heated up by the dissipated heat is recuperated in an outdoor cooling system. An attempt at the applications of silver nano-fluids as a working fluid in heat pipes and thermal network is also conducted in the present study. Silver nano-fluids are thermochemically synthesized by a microwave heating technique, which allows for superior stable suspension characteristics.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages619-624
Number of pages6
DOIs
Publication statusPublished - Jun 30 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume2

Other

Other2009 ASME InterPack Conference, IPACK2009
Country/TerritoryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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