Abstract
Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.
| Original language | English |
|---|---|
| Pages (from-to) | 384-388 |
| Number of pages | 5 |
| Journal | Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals |
| Volume | 70 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Apr 1 2006 |
| Externally published | Yes |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys
- Materials Chemistry
Cite this
Advanced transmission electron microscopy on silver-based conductive adhesive. / Kawamoto, Naoyuki; Murakami, Yasukazu; Shindo, Daisuke; Kim, Keunsoo; Suganuma, Katsuaki.
In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 70, No. 4, 01.04.2006, p. 384-388.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Advanced transmission electron microscopy on silver-based conductive adhesive
AU - Kawamoto, Naoyuki
AU - Murakami, Yasukazu
AU - Shindo, Daisuke
AU - Kim, Keunsoo
AU - Suganuma, Katsuaki
PY - 2006/4/1
Y1 - 2006/4/1
N2 - Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.
AB - Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.
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UR - http://www.scopus.com/inward/citedby.url?scp=33744796947&partnerID=8YFLogxK
U2 - 10.2320/jinstmet.70.384
DO - 10.2320/jinstmet.70.384
M3 - Article
AN - SCOPUS:33744796947
VL - 70
SP - 384
EP - 388
JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
SN - 0021-4876
IS - 4
ER -