Advanced transmission electron microscopy on silver-based conductive adhesive

Naoyuki Kawamoto; Yasukazu Murakami; Daisuke Shindo; Keunsoo Kim; Katsuaki Suganuma

doi:10.2320/jinstmet.70.384

Advanced transmission electron microscopy on silver-based conductive adhesive

Naoyuki Kawamoto, Yasukazu Murakami, Daisuke Shindo, Keunsoo Kim, Katsuaki Suganuma

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.

Original language	English
Pages (from-to)	384-388
Number of pages	5
Journal	Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume	70
Issue number	4
DOIs	https://doi.org/10.2320/jinstmet.70.384
Publication status	Published - Apr 1 2006
Externally published	Yes

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Mechanics of Materials
Metals and Alloys
Materials Chemistry

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10.2320/jinstmet.70.384

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AU - Murakami, Yasukazu

AU - Shindo, Daisuke

AU - Kim, Keunsoo

AU - Suganuma, Katsuaki

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AB - Microstructure of a recently developed silver-based conductive adhesive, which is expected as a substitute for conventional soldering, has been studied by advanced transmission electron microscopy (TEM). Energy-filtered TEM has revealed the feature of dispersion of silver particles. Conductivity between neighbored particles is evaluated inside the electron microscope by using two microprobes that can be operated independently. The results shed light on the development of the silver-based conductive adhesive.

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