Advances in CMP Polishing Technologies

Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

Research output: Book/ReportBook

7 Citations (Scopus)

Abstract

Advances in CMP Polishing Technologies demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering.

Original languageEnglish
PublisherElsevier Inc.
ISBN (Print)9781437778595
DOIs
Publication statusPublished - Jan 1 2012

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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