Aging behavior of Cu-Ni-Si alloy processed by high-pressure torsion

Hirotaka Matsunaga, Zenji Horita, Kazutaka Imamura, Takanobu Kiss, Xavier Sauvage

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to ∼150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ∼20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.

Original languageEnglish
Title of host publicationNanomaterials by Severe Plastic Deformation, NanoSPD5
Pages307-312
Number of pages6
DOIs
Publication statusPublished - Feb 25 2011
Event5th International Conference on Nanomaterials by Severe Plastic Deformation, NanoSPD5 - Nanjing, China
Duration: Mar 21 2011Mar 25 2011

Publication series

NameMaterials Science Forum
Volume667-669
ISSN (Print)0255-5476

Other

Other5th International Conference on Nanomaterials by Severe Plastic Deformation, NanoSPD5
CountryChina
CityNanjing
Period3/21/113/25/11

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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