Amorphization induced by low-energy ion irradiation in silicon

Dong Ju Bai, Tomohiro Kawase, Akiyoshi Baba, Atsushi Kenjo, Taizoh Sadoh, Hiroshi Nakashima, Hiroshi Mori, Toshio Tsurushima

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1 Citation (Scopus)

Abstract

Amorphization of silicon crystals irradiated with low-energy (10-25 keV) Ar+ beams at temperature in the range of 30-600°C has been studied. Thickness of the damaged layer was estimated by the ion-bombardment-enhanced selective etching (IBESE) technique. Critical dose for the amorphization was estimated to be ∼ 5 × 1013 ions/cm2 for irradiation of 10 and 20 keV Ar+ at 30°C. Comparison between the damaged layer thickness and results of the TRIM simulation shows that the etching stops at the depth where density of the deposited energy is a constant value. For irradiation temperature of 380°C and 400°C, no amorphized layer was observed after irradiation with 20 keV Ar+ to dose of 5 × 1014 and 2 × 1015 ions/cm2, respectively. The damaged layers disappeared after annealing at temperature above 400°C, and activation energy for the recovery was estimated to be 0.33 eV. From the value of the activation energy, we speculate that the recovery process of radiation-induced defects should be controlled by migration of vacancies.

Original languageEnglish
Pages (from-to)163-166
Number of pages4
JournalResearch Reports on Information Science and Electrical Engineering of Kyushu University
Volume2
Issue number1
Publication statusPublished - Mar 1997

All Science Journal Classification (ASJC) codes

  • Computer Science(all)
  • Electrical and Electronic Engineering

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