An analysis for cracks parallel to the interface of bimaterial systems

Wenxue Wang, Yoshihiro Takao

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This paper solves a plane strain problem for two bonded dissimilar planes containing two cracks parallel to the interface. The bimaterial system is loaded by tractions distributed along the crack surfaces. Based on the Fourier transform, the problem is reduced to a system of Cauchy-type singular integral equations that contain exact and explicit kernel functions. The solution of these equations are obtained easily by utilizing Gauss-Chebyshev formulae for various material combinations and geometrical parameters. Several numerical examples of stress intensity factors, energy release rates, and crack opening displacement are presented to exhibit the interactions among the interface and cracks.

Original languageEnglish
Pages (from-to)31-50
Number of pages20
JournalJournal of Thermoplastic Composite Materials
Volume10
Issue number1
DOIs
Publication statusPublished - Jan 1 1997

Fingerprint

cracks
Cracks
singular integral equations
kernel functions
surface cracks
crack opening displacement
stress intensity factors
traction
plane strain
Energy release rate
Stress intensity factors
Integral equations
Fourier transforms
interactions
energy

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Condensed Matter Physics

Cite this

An analysis for cracks parallel to the interface of bimaterial systems. / Wang, Wenxue; Takao, Yoshihiro.

In: Journal of Thermoplastic Composite Materials, Vol. 10, No. 1, 01.01.1997, p. 31-50.

Research output: Contribution to journalArticle

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