An image-based microscale simulation of thermal residual stresses in DSE oxide ceramic composite

Jian Jun Sha, S. Ochiai, H. Okuda, S. Iwamoto, K. Morishita, Y. Waku, N. Nakagawa, A. Mitani, T. Ishikawa, M. Sato

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An image-based microscale analysis was conducted by using finite element method (FEM) to simulate the thermal residual stresses in directionally solidified eutectic (DSE) oxide ceramic composites from the thermal expansion and elastic properties and the microstructure features of the constituent phases. This microscale analysis allows a real simulation of morphologies of constituent phases such as size, array and shape. Meanwhile, this model can be applied not only for the calculation of thermal residual stresses, but also for the calculation of mechanical properties. In this work, simulations focus on the distribution of thermal residual stresses in the directionally solidified eutectic (DSE) Al2O3/ Y3Al5O 12 (YAG) ceramic composite. A good agreement between simulated and measured thermal residual stresses was observed.

Original languageEnglish
Title of host publicationManufacturing Process Technology
Pages1681-1686
Number of pages6
DOIs
Publication statusPublished - Mar 16 2011
Externally publishedYes
Event2nd International Conference on Manufacturing Science and Engineering, ICMSE 2011 - Guilin, China
Duration: Apr 9 2011Apr 11 2011

Publication series

NameAdvanced Materials Research
Volume189-193
ISSN (Print)1022-6680

Other

Other2nd International Conference on Manufacturing Science and Engineering, ICMSE 2011
CountryChina
CityGuilin
Period4/9/114/11/11

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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