An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance

Tasuku Hayashi, Haruka Muramatsu, Keisei Maehisa, Noriko Y. Yamasaki, Kazuhisa Mitsuda, Akira Takano, Shota Yoshimoto, Keisuke Maehata, Mutsuo Hidaka, Hirotake Yamamori, Toru Hara

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A detector head for an energy-dispersive X-ray spectroscopy (EDS) for a scanning transmission electron microscope (STEM) was designed, fabricated, and tested. A 64-pixel TES X-ray microcalorimeter and 64 SQUID array amplifiers (SAAs) are mounted on a detector head which is cooled to about 100 mK. The body of the detector head is a copper rod of about 1cm2 cross section and 10 cm length with 3 cm cubic structure at the bottom. The TES microcalorimeter is mounted at the top of the rod while the SAAs are mounted on the four side surfaces of the cubic structure. In order to reduce the number of wire bondings, we adopted a flip-chip bonding for the SAAs. In order to reduce the stress imposed on the flip-chip bondings due to the difference in the linear thermal expansion of the SAA chip and the mounting surfaces, we mounted the SAAs and connectors to the room-temperature electronics on sapphire circuit board and mounted the SAAs and connectors using a superconducting flip-chip bonding technology. Then, both the TES and the sapphire circuit board were mounted on the rod and are connected to the print circuit like superconducting wires, which are created on the multiple surfaces of the rod, with Al wire bondings. We reduced the number of wire bondings from 768 to 256. The yield of the flip-chip bonding was not perfect but relatively high. We installed the detector head in the STEM EDS system, confirmed that the energy resolution and counting requirements, ΔE<10eV with 5 kcps were fulfilled.

Original languageEnglish
Pages (from-to)1282-1286
Number of pages5
JournalJournal of Low Temperature Physics
Volume193
Issue number5-6
DOIs
Publication statusPublished - Dec 1 2018

Fingerprint

SQUIDs
assembly
Detectors
amplifiers
X rays
detectors
chips
rods
wire
x rays
Aluminum Oxide
connectors
circuit boards
Wire
Sapphire
calorimeters
Networks (circuits)
Energy dispersive spectroscopy
sapphire
Electron microscopes

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Hayashi, T., Muramatsu, H., Maehisa, K., Yamasaki, N. Y., Mitsuda, K., Takano, A., ... Hara, T. (2018). An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance. Journal of Low Temperature Physics, 193(5-6), 1282-1286. https://doi.org/10.1007/s10909-018-2013-1

An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance. / Hayashi, Tasuku; Muramatsu, Haruka; Maehisa, Keisei; Yamasaki, Noriko Y.; Mitsuda, Kazuhisa; Takano, Akira; Yoshimoto, Shota; Maehata, Keisuke; Hidaka, Mutsuo; Yamamori, Hirotake; Hara, Toru.

In: Journal of Low Temperature Physics, Vol. 193, No. 5-6, 01.12.2018, p. 1282-1286.

Research output: Contribution to journalArticle

Hayashi, T, Muramatsu, H, Maehisa, K, Yamasaki, NY, Mitsuda, K, Takano, A, Yoshimoto, S, Maehata, K, Hidaka, M, Yamamori, H & Hara, T 2018, 'An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance', Journal of Low Temperature Physics, vol. 193, no. 5-6, pp. 1282-1286. https://doi.org/10.1007/s10909-018-2013-1
Hayashi T, Muramatsu H, Maehisa K, Yamasaki NY, Mitsuda K, Takano A et al. An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance. Journal of Low Temperature Physics. 2018 Dec 1;193(5-6):1282-1286. https://doi.org/10.1007/s10909-018-2013-1
Hayashi, Tasuku ; Muramatsu, Haruka ; Maehisa, Keisei ; Yamasaki, Noriko Y. ; Mitsuda, Kazuhisa ; Takano, Akira ; Yoshimoto, Shota ; Maehata, Keisuke ; Hidaka, Mutsuo ; Yamamori, Hirotake ; Hara, Toru. / An X-ray TES Detector Head Assembly for a STEM–EDS System and Its Performance. In: Journal of Low Temperature Physics. 2018 ; Vol. 193, No. 5-6. pp. 1282-1286.
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