Analysis of tungsten film electrodeposited from a ZnCl2-NaCl-KCl melt

Koji Nitta, Shinji Inazawa, Kazunori Okada, Hironori Nakajima, Toshiyuki Nohira, Rika Hagiwara

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

Microparts for micro-electro-mechanical systems (MEMS) are becoming increasingly important, and the Lithographie Galvanoformung Abformung (LIGA) process for producing such parts is attracting attention [1]. However, as this process requires the step of electroplating in aqueous solution, only copper, nickel and their alloys can be used because of the limit of the potential window of water. We have been attempting to apply the electroplating of refractory metals in molten salts to the LIGA process or to the surface coating of conventional LIGA microparts in order to give higher strength and heat resistance for the microparts. Herein we report the characteristics of a tungsten film electrodeposited from a ZnCl2-NaCl-KCl melt at 250 °C.

Original languageEnglish
Pages (from-to)20-23
Number of pages4
JournalElectrochimica Acta
Volume53
Issue number1
DOIs
Publication statusPublished - Nov 20 2007
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Electrochemistry

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