The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.
|Number of pages||4|
|Publication status||Published - Nov 1 2012|
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering