Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5

D. Mu; H. Huang; K. Nogita

doi:10.1016/j.matlet.2012.07.018

Anisotropic mechanical properties of Cu ₆Sn ₅ and (Cu,Ni) ₆Sn ₅

D. Mu, H. Huang, K. Nogita

Faculty of Engineering

Research output: Contribution to journal › Article › peer-review

58 Citations (Scopus)

Abstract

The mechanical reliability of solder joints is influenced by a layer of Cu ₆Sn ₅ intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu ₆Sn ₅ are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu ₆Sn ₅ may find practical applications in designing soldering processes to obtain preferred IMC orientations.

Original language	English
Pages (from-to)	46-49
Number of pages	4
Journal	Materials Letters
Volume	86
DOIs	https://doi.org/10.1016/j.matlet.2012.07.018
Publication status	Published - Nov 1 2012

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.matlet.2012.07.018

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title = "Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 ",

abstract = "The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.",

author = "D. Mu and H. Huang and K. Nogita",

note = "Funding Information: The authors would like to thank Mr J. Read, Dr. S. McDonald and Dr Y-Q Wu (UQ) for sample preparation and stimulating discussion. The authors are also grateful to the financial supports under an International Cooperative Research Program between the University of Queensland (UQ), Australia and Nihon Superior Company, Japan and the ARC Linkage Project program (no. LP100200250 ). D. Mu is financially supported by an Australian Postgraduate Award . The authors acknowledge the facilities, and the scientific and technical assistance, of the Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis, The University of Queensland. ",

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doi = "10.1016/j.matlet.2012.07.018",

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AU - Mu, D.

AU - Huang, H.

AU - Nogita, K.

N1 - Funding Information: The authors would like to thank Mr J. Read, Dr. S. McDonald and Dr Y-Q Wu (UQ) for sample preparation and stimulating discussion. The authors are also grateful to the financial supports under an International Cooperative Research Program between the University of Queensland (UQ), Australia and Nihon Superior Company, Japan and the ARC Linkage Project program (no. LP100200250 ). D. Mu is financially supported by an Australian Postgraduate Award . The authors acknowledge the facilities, and the scientific and technical assistance, of the Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis, The University of Queensland.

PY - 2012/11/1

Y1 - 2012/11/1

N2 - The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.

AB - The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.

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JO - Materials Letters

JF - Materials Letters

ER -

Anisotropic mechanical properties of Cu ₆Sn ₅ and (Cu,Ni) ₆Sn ₅

Abstract

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