Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5

D. Mu, H. Huang, Kazuhiro Nogita

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.

Original languageEnglish
Pages (from-to)46-49
Number of pages4
JournalMaterials Letters
Volume86
DOIs
Publication statusPublished - Nov 1 2012

Fingerprint

solders
Soldering alloys
Intermetallics
intermetallics
mechanical properties
Mechanical properties
soldering
Tin
Soldering
Nanoindentation
nanoindentation
Crystal orientation
tin
Diffraction
Electrons
Substrates
diffraction
crystals
electrons

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 . / Mu, D.; Huang, H.; Nogita, Kazuhiro.

In: Materials Letters, Vol. 86, 01.11.2012, p. 46-49.

Research output: Contribution to journalArticle

Mu, D. ; Huang, H. ; Nogita, Kazuhiro. / Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 In: Materials Letters. 2012 ; Vol. 86. pp. 46-49.
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