Anisotropic mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5

D. Mu, H. Huang, K. Nogita

Research output: Contribution to journalArticlepeer-review

50 Citations (Scopus)

Abstract

The mechanical reliability of solder joints is influenced by a layer of Cu 6Sn 5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu 6Sn 5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu 6Sn 5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.

Original languageEnglish
Pages (from-to)46-49
Number of pages4
JournalMaterials Letters
Volume86
DOIs
Publication statusPublished - Nov 1 2012

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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