Annealing behavior and recrystallized texture in ARB processed copper

Naoki Takata, Kousuke Yamada, Ken Ich Ikeda, Fuyuki Yoshida, Hideharu Nakashima, Nobuhiro Tsuji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

The recrystallization behavior and texture development in copper accumulative roll-bonding (ARB) processed by various cycles (2, 4 and 6 cycle) were studied by differential scanning calorimetry (DSC) analysis and SEM/EBSP method. The exothermic peaks caused by recrystallization appeared at 210 - 253°C in each sample. The peak positions shifted to lower temperature as the number of ARB cycles increased. This result indicated that the evolution of finer microstracture with increasing number of the ARB cycles enhanced the occurrence of recrystallization at lower temperature. The stored energy calculated from the DSC curve of the ARB processed copper increased with the increasing strains. During an annealing, the preferential growth of cube-oriented grains ({100}〈001〉) occurred in each sample. The recystallization behavior of ARB processed copper having low stacking fault energies was distinguished from that of so-called "recovery type" materials, i.e. aluminum and low carbon steels, which shows rather continuous changes in microstructure during annealing. The accumulated strains provided the driving force for the preferential growth, which was the same mechanism as the preferential growth in normally rolled copper. The sharpest cube texture developed in ARB processed copper by 4 cycles. The difference of cube texture development between 2 cycles and 4 cycles was caused by the distribution of cube-oriented regions which corresponded to the nucleation sites of recrystallized grains before annealing. More nanocystalline layers in the vicinity of bonded interfaces were distributed in ARB processed copper by 6 cycles than 4cycles. The nanocystalline structure could grow faster than the cube-oriented grains and led to the inhibition of sharp cube texture in the ARB processed copper by 6 cycles.

Original languageEnglish
Title of host publicationNanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation
Pages919-924
Number of pages6
Publication statusPublished - Dec 1 2006
Event3rd International Conference on Nanomaterials by Severe Plastics Deformation, NanoSPD3 - Fukuoka, Japan
Duration: Sep 22 2005Sep 26 2005

Publication series

NameMaterials Science Forum
Volume503-504
ISSN (Print)0255-5476

Other

Other3rd International Conference on Nanomaterials by Severe Plastics Deformation, NanoSPD3
CountryJapan
CityFukuoka
Period9/22/059/26/05

Fingerprint

Roll bonding
Copper
textures
Textures
Annealing
copper
cycles
annealing
Differential scanning calorimetry
heat measurement
stacking fault energy
Stacking faults
Low carbon steel
low carbon steels
scanning
Aluminum
Nucleation
recovery
Recovery
nucleation

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Takata, N., Yamada, K., Ikeda, K. I., Yoshida, F., Nakashima, H., & Tsuji, N. (2006). Annealing behavior and recrystallized texture in ARB processed copper. In Nanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation (pp. 919-924). (Materials Science Forum; Vol. 503-504).

Annealing behavior and recrystallized texture in ARB processed copper. / Takata, Naoki; Yamada, Kousuke; Ikeda, Ken Ich; Yoshida, Fuyuki; Nakashima, Hideharu; Tsuji, Nobuhiro.

Nanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation. 2006. p. 919-924 (Materials Science Forum; Vol. 503-504).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takata, N, Yamada, K, Ikeda, KI, Yoshida, F, Nakashima, H & Tsuji, N 2006, Annealing behavior and recrystallized texture in ARB processed copper. in Nanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation. Materials Science Forum, vol. 503-504, pp. 919-924, 3rd International Conference on Nanomaterials by Severe Plastics Deformation, NanoSPD3, Fukuoka, Japan, 9/22/05.
Takata N, Yamada K, Ikeda KI, Yoshida F, Nakashima H, Tsuji N. Annealing behavior and recrystallized texture in ARB processed copper. In Nanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation. 2006. p. 919-924. (Materials Science Forum).
Takata, Naoki ; Yamada, Kousuke ; Ikeda, Ken Ich ; Yoshida, Fuyuki ; Nakashima, Hideharu ; Tsuji, Nobuhiro. / Annealing behavior and recrystallized texture in ARB processed copper. Nanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation. 2006. pp. 919-924 (Materials Science Forum).
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