Application of dielectric isolation technology based on soot bonding

Renshi Sawada, H. Nakada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. In this method, the Si-B-O soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. This soot bonding method is effective even for joining a surface with deep V-grooves or trenches, as well as for rough poly-Si-deposited surfaces. The ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction.

Original languageEnglish
Title of host publicationProc 3 Int Symp Power Semicond Devices ICs ISPSD 91
EditorsAyman M. Shibib, Jayant B. Baliga
PublisherPubl by IEEE
Pages203-208
Number of pages6
ISBN (Print)0780300092
Publication statusPublished - 1991
Externally publishedYes
EventProceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs - ISPSD '91 - Baltimore, MD, USA
Duration: Apr 22 1991Apr 24 1991

Other

OtherProceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs - ISPSD '91
CityBaltimore, MD, USA
Period4/22/914/24/91

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Application of dielectric isolation technology based on soot bonding'. Together they form a unique fingerprint.

Cite this