Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

    Original languageEnglish
    Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Number of pages1
    ISBN (Electronic)9784904743034
    DOIs
    Publication statusPublished - Jun 13 2017
    Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
    Duration: May 16 2017May 18 2017

    Publication series

    NameProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

    Other

    Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    Country/TerritoryJapan
    CityTokyo
    Period5/16/175/18/17

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films

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