Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages64
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - Jun 13 2017
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: May 16 2017May 18 2017

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period5/16/175/18/17

Fingerprint

Atmospheric pressure
Contamination
Plasmas
Air
Argon
Gas mixtures
Hydrogen
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Yamamoto, M., Higurashi, E., Suga, T., Sawada, R., & Itoh, T. (2017). Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 64). [7947460] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947460

Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. / Yamamoto, Michitaka; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi; Itoh, Toshihiro.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 64 7947460.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamamoto, M, Higurashi, E, Suga, T, Sawada, R & Itoh, T 2017, Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947460, Institute of Electrical and Electronics Engineers Inc., pp. 64, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 5/16/17. https://doi.org/10.23919/LTB-3D.2017.7947460
Yamamoto M, Higurashi E, Suga T, Sawada R, Itoh T. Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 64. 7947460 https://doi.org/10.23919/LTB-3D.2017.7947460
Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi ; Itoh, Toshihiro. / Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 64
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