Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam

Yutaka Ohno, Hideto Yoshida, Naoto Kamiuchi, Ryotaro Aso, Seiji Takeda, Yasuo Shimizu, Naoki Ebisawa, Yasuyoshi Nagai, Jianbo Liang, Naoteru Shigekawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - May 2019
Externally publishedYes
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: May 21 2019May 25 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period5/21/195/25/19

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Ohno, Y., Yoshida, H., Kamiuchi, N., Aso, R., Takeda, S., Shimizu, Y., Ebisawa, N., Nagai, Y., Liang, J., & Shigekawa, N. (2019). Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735379] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735379