Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam

Yutaka Ohno; Hideto Yoshida; Naoto Kamiuchi; Ryotaro Aso; Seiji Takeda; Yasuo Shimizu; Naoki Ebisawa; Yasuyoshi Nagai; Jianbo Liang; Naoteru Shigekawa

doi:10.23919/LTB-3D.2019.8735379

Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam

Yutaka Ohno, Hideto Yoshida, Naoto Kamiuchi, Ryotaro Aso, Seiji Takeda, Yasuo Shimizu, Naoki Ebisawa, Yasuyoshi Nagai, Jianbo Liang, Naoteru Shigekawa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.

Original language	English
Title of host publication	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Number of pages	1
ISBN (Electronic)	9784904743072
DOIs	https://doi.org/10.23919/LTB-3D.2019.8735379
Publication status	Published - May 2019
Externally published	Yes
Event	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan Duration: May 21 2019 → May 25 2019

Publication series

Name	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country	Japan
City	Kanazawa, Ishikawa
Period	5/21/19 → 5/25/19

All Science Journal Classification (ASJC) codes

Process Chemistry and Technology
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/LTB-3D.2019.8735379

Fingerprint Dive into the research topics of 'Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam'. Together they form a unique fingerprint.

Cite this

Ohno, Y., Yoshida, H., Kamiuchi, N., Aso, R., Takeda, S., Shimizu, Y., Ebisawa, N., Nagai, Y., Liang, J., & Shigekawa, N. (2019). Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735379] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735379

Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. / Ohno, Yutaka; Yoshida, Hideto; Kamiuchi, Naoto; Aso, Ryotaro; Takeda, Seiji; Shimizu, Yasuo; Ebisawa, Naoki; Nagai, Yasuyoshi; Liang, Jianbo; Shigekawa, Naoteru.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735379 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ohno, Y, Yoshida, H, Kamiuchi, N, Aso, R, Takeda, S, Shimizu, Y, Ebisawa, N, Nagai, Y, Liang, J & Shigekawa, N 2019, Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. in Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735379, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 5/21/19. https://doi.org/10.23919/LTB-3D.2019.8735379

Ohno Y, Yoshida H, Kamiuchi N, Aso R, Takeda S, Shimizu Y et al. Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735379. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735379

Ohno, Yutaka ; Yoshida, Hideto ; Kamiuchi, Naoto ; Aso, Ryotaro ; Takeda, Seiji ; Shimizu, Yasuo ; Ebisawa, Naoki ; Nagai, Yasuyoshi ; Liang, Jianbo ; Shigekawa, Naoteru. / Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

@inproceedings{9de39e0dcb0a4da0a545b586ff83acc2,

title = "Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam",

abstract = "Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.",

author = "Yutaka Ohno and Hideto Yoshida and Naoto Kamiuchi and Ryotaro Aso and Seiji Takeda and Yasuo Shimizu and Naoki Ebisawa and Yasuyoshi Nagai and Jianbo Liang and Naoteru Shigekawa",

year = "2019",

month = may,

doi = "10.23919/LTB-3D.2019.8735379",

language = "English",

series = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",

address = "United States",

note = "6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 ; Conference date: 21-05-2019 Through 25-05-2019",

}

TY - GEN

T1 - Artifacts in the structural analysis of SAB-fabricated interfaces by using focused ion beam

AU - Ohno, Yutaka

AU - Yoshida, Hideto

AU - Kamiuchi, Naoto

AU - Aso, Ryotaro

AU - Takeda, Seiji

AU - Shimizu, Yasuo

AU - Ebisawa, Naoki

AU - Nagai, Yasuyoshi

AU - Liang, Jianbo

AU - Shigekawa, Naoteru

PY - 2019/5

Y1 - 2019/5

N2 - Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.

AB - Atomistic structure of interfaces fabricated by surface activated bonding (SAB) at room temperature can be modified under the irradiation of a focused ion beam for structural analysis, presumably due to the migration of atoms assisted by point defects that are introduced during the SAB process.

UR - http://www.scopus.com/inward/record.url?scp=85068394940&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068394940&partnerID=8YFLogxK

U2 - 10.23919/LTB-3D.2019.8735379

DO - 10.23919/LTB-3D.2019.8735379

M3 - Conference contribution

T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Y2 - 21 May 2019 through 25 May 2019

ER -