Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound

Wenhui Yang, Tomokazu Yamamoto, Kohei Aso, Flora Somidin, Kazuhiro Nogita, Syo Matsumura

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The present study has succeeded in direct determination of the location of dopant Ni atoms in η-(Cu,Ni)6Sn5 by aberration-corrected scanning transmission electron microscopy (STEM) including atomic-resolution imaging as well as elemental mapping by X-ray energy-dispersive spectroscopy (XEDS). The three sublattices of Sn, Cu1 and Cu2 were distinguished in atomic-resolution images observed along the [21¯1¯0] direction. Atomic-resolution XEDS maps have verified for the first time that the dopant Ni atoms located at the Cu2 sites in η-(Cu,Ni)6Sn5, taking advantage of the Poisson non-local principal component analysis (NLPCA) processing and the lattice-averaging procedure.

Original languageEnglish
Pages (from-to)1-5
Number of pages5
JournalScripta Materialia
Volume158
DOIs
Publication statusPublished - Jan 1 2019

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Intermetallics
intermetallics
Doping (additives)
Atoms
image resolution
Image resolution
principal components analysis
Aberrations
Principal component analysis
spectroscopy
sublattices
atoms
aberration
x rays
Transmission electron microscopy
Imaging techniques
transmission electron microscopy
Scanning electron microscopy
scanning electron microscopy
energy

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Cite this

Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. / Yang, Wenhui; Yamamoto, Tomokazu; Aso, Kohei; Somidin, Flora; Nogita, Kazuhiro; Matsumura, Syo.

In: Scripta Materialia, Vol. 158, 01.01.2019, p. 1-5.

Research output: Contribution to journalArticle

Yang, Wenhui ; Yamamoto, Tomokazu ; Aso, Kohei ; Somidin, Flora ; Nogita, Kazuhiro ; Matsumura, Syo. / Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. In: Scripta Materialia. 2019 ; Vol. 158. pp. 1-5.
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