AuAu surface-activated bonding and Its application to optical microsensors with 3-D structure

Eiji Higurashi, Daisuke Chino, Tadatomo Suga, Renshi Sawada

Research output: Contribution to journalArticle

77 Citations (Scopus)

Abstract

Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using AuAu surface-activated bonding (SAB) at a relatively low bonding temperature of 150°C. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using AuAu SAB. By applying this technique, compact and thin optical microsensors (2.8 mm × 2.8 mm × 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.

Original languageEnglish
Article number5130228
Pages (from-to)1500-1505
Number of pages6
JournalIEEE Journal on Selected Topics in Quantum Electronics
Volume15
Issue number5
DOIs
Publication statusPublished - Sep 1 2009

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Microsensors
chips
Microsystems
Substrates
Photodiodes
Optoelectronic devices
Semiconductor lasers
Glass
photodiodes
semiconductor lasers
prototypes
glass
Temperature

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

AuAu surface-activated bonding and Its application to optical microsensors with 3-D structure. / Higurashi, Eiji; Chino, Daisuke; Suga, Tadatomo; Sawada, Renshi.

In: IEEE Journal on Selected Topics in Quantum Electronics, Vol. 15, No. 5, 5130228, 01.09.2009, p. 1500-1505.

Research output: Contribution to journalArticle

Higurashi, Eiji ; Chino, Daisuke ; Suga, Tadatomo ; Sawada, Renshi. / AuAu surface-activated bonding and Its application to optical microsensors with 3-D structure. In: IEEE Journal on Selected Topics in Quantum Electronics. 2009 ; Vol. 15, No. 5. pp. 1500-1505.
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