Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using AuAu surface-activated bonding (SAB) at a relatively low bonding temperature of 150°C. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using AuAu SAB. By applying this technique, compact and thin optical microsensors (2.8 mm × 2.8 mm × 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
|Number of pages||6|
|Journal||IEEE Journal on Selected Topics in Quantum Electronics|
|Publication status||Published - Sep 1 2009|
All Science Journal Classification (ASJC) codes
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering