AuAu surface-activated bonding and Its application to optical microsensors with 3-D structure

Eiji Higurashi, Daisuke Chino, Tadatomo Suga, Renshi Sawada

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79 Citations (Scopus)

Abstract

Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using AuAu surface-activated bonding (SAB) at a relatively low bonding temperature of 150°C. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using AuAu SAB. By applying this technique, compact and thin optical microsensors (2.8 mm × 2.8 mm × 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.

Original languageEnglish
Article number5130228
Pages (from-to)1500-1505
Number of pages6
JournalIEEE Journal on Selected Topics in Quantum Electronics
Volume15
Issue number5
DOIs
Publication statusPublished - Sep 1 2009

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All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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