AUTOMATIC THICKNESS MEASUREMENT OF A SINGLE Si CRYSTAL ISLAND SURROUNDED BY SiO//2 DIELECTRIC FILM AND POLYSILICON LAYER.

Renshi Sawada, Toshiroh Karaki, Junji Watanabe

    Research output: Contribution to journalArticlepeer-review

    Abstract

    A method and instrument for thickness measurement of a single Si crystal island in a compounded substrate consisting of a single Si crystal surrounded by SiO//2 dielectric film and polysilicon layer, the so-called dielectric insulation wafer, are described. The measuring instrument to which the Lichtschnitt method is applied, using an infrared slit beam, provided satisfactory accuracy within plus or minus 1. 5 mu m for the island thickness range from 10 to 400 mu m.

    Original languageEnglish
    Pages (from-to)293-298
    Number of pages6
    JournalBulletin of the Japan Society of Precision Engineering
    Volume18
    Issue number4
    Publication statusPublished - Dec 1 1984

    All Science Journal Classification (ASJC) codes

    • Engineering(all)

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