Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, J. Read, K. Nogita

Research output: Contribution to journalArticle

Abstract

Recent environmental and health concerns regarding the toxicity of lead have facilitated the development of lead-free solder alloys with suitable soldering characteristics and mechanical properties. Compared to the lead-containing solders, however, the lead-free solders are stiffer and less deformable during dynamic loading. In the present study, the shear and pull ball tests were employed to evaluate the impact strength of solder ball attachments. Tests were conducted on as-reflowed and aged Ni-doped and non-Ni-doped Sn-Cu solder ball grid arrays (BGAs) placed on Cu substrates over a wide range of displacement rates. Trace Ni addition to the Sn-Cu solders prevented the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Sn-Cu-Ni BGA joints show superior properties in high speed shear and pull impact tests.

Original languageEnglish
Pages (from-to)10-16
Number of pages7
JournalMaterials Forum
Volume34
Publication statusPublished - 2008
Externally publishedYes

Fingerprint

solders
Soldering alloys
balls
Ball grid arrays
Intermetallics
Lead
intermetallics
Soldering
Impact strength
grids
shear
Toxicity
impact strength
impact tests
soldering
Health
toxicity
Mechanical properties
health
attachment

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Read, J., & Nogita, K. (2008). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. Materials Forum, 34, 10-16.

Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. / Tsukamoto, H.; Nishimura, T.; Suenaga, S.; McDonald, S. D.; Read, J.; Nogita, K.

In: Materials Forum, Vol. 34, 2008, p. 10-16.

Research output: Contribution to journalArticle

Tsukamoto, H, Nishimura, T, Suenaga, S, McDonald, SD, Read, J & Nogita, K 2008, 'Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints', Materials Forum, vol. 34, pp. 10-16.
Tsukamoto H, Nishimura T, Suenaga S, McDonald SD, Read J, Nogita K. Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. Materials Forum. 2008;34:10-16.
Tsukamoto, H. ; Nishimura, T. ; Suenaga, S. ; McDonald, S. D. ; Read, J. ; Nogita, K. / Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: Materials Forum. 2008 ; Vol. 34. pp. 10-16.
@article{d956346fb62b406b95dc676af42d32ba,
title = "Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints",
abstract = "Recent environmental and health concerns regarding the toxicity of lead have facilitated the development of lead-free solder alloys with suitable soldering characteristics and mechanical properties. Compared to the lead-containing solders, however, the lead-free solders are stiffer and less deformable during dynamic loading. In the present study, the shear and pull ball tests were employed to evaluate the impact strength of solder ball attachments. Tests were conducted on as-reflowed and aged Ni-doped and non-Ni-doped Sn-Cu solder ball grid arrays (BGAs) placed on Cu substrates over a wide range of displacement rates. Trace Ni addition to the Sn-Cu solders prevented the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Sn-Cu-Ni BGA joints show superior properties in high speed shear and pull impact tests.",
author = "H. Tsukamoto and T. Nishimura and S. Suenaga and McDonald, {S. D.} and J. Read and K. Nogita",
year = "2008",
language = "English",
volume = "34",
pages = "10--16",
journal = "Materials Forum",
issn = "0883-2900",
publisher = "Institute of Metals and Materials Australasia",

}

TY - JOUR

T1 - Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

AU - Tsukamoto, H.

AU - Nishimura, T.

AU - Suenaga, S.

AU - McDonald, S. D.

AU - Read, J.

AU - Nogita, K.

PY - 2008

Y1 - 2008

N2 - Recent environmental and health concerns regarding the toxicity of lead have facilitated the development of lead-free solder alloys with suitable soldering characteristics and mechanical properties. Compared to the lead-containing solders, however, the lead-free solders are stiffer and less deformable during dynamic loading. In the present study, the shear and pull ball tests were employed to evaluate the impact strength of solder ball attachments. Tests were conducted on as-reflowed and aged Ni-doped and non-Ni-doped Sn-Cu solder ball grid arrays (BGAs) placed on Cu substrates over a wide range of displacement rates. Trace Ni addition to the Sn-Cu solders prevented the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Sn-Cu-Ni BGA joints show superior properties in high speed shear and pull impact tests.

AB - Recent environmental and health concerns regarding the toxicity of lead have facilitated the development of lead-free solder alloys with suitable soldering characteristics and mechanical properties. Compared to the lead-containing solders, however, the lead-free solders are stiffer and less deformable during dynamic loading. In the present study, the shear and pull ball tests were employed to evaluate the impact strength of solder ball attachments. Tests were conducted on as-reflowed and aged Ni-doped and non-Ni-doped Sn-Cu solder ball grid arrays (BGAs) placed on Cu substrates over a wide range of displacement rates. Trace Ni addition to the Sn-Cu solders prevented the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Sn-Cu-Ni BGA joints show superior properties in high speed shear and pull impact tests.

UR - http://www.scopus.com/inward/record.url?scp=84875895581&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84875895581&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:84875895581

VL - 34

SP - 10

EP - 16

JO - Materials Forum

JF - Materials Forum

SN - 0883-2900

ER -