Basic characteristics of a simultaneous double-side CMP machine, housed in a sealed, pressure-resistance container

Kei Kitamura, Toshiro Doi, Syuhei Kurokawa, Yoji Umezaki, Yoji Matsukawa, Yota Ooki, Tadashi Hasegawa, Isamu Koshiyama, Koichiro Ichikawa, Yoshio Nakamura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

We designed and manufactured a prototype of a unique CMP machine, which can perform double-side CMP simultaneously in a sealed and pressure container as regarding effective action of the processing atmosphere around workpieces as important. Polishing experiments with single crystal silicon (Si) wafers (100) are performed by charging the container with various gases. As a result, the removal rates increased by up to 25% under high pressure oxygen gas atmosphere.

Original languageEnglish
Title of host publicationAdvances in Precision Engineering
Pages61-65
Number of pages5
DOIs
Publication statusPublished - Dec 29 2010
EventICoPE2010 and 13th ICPE International Conference on Precision Engineering - , Singapore
Duration: Jul 28 2010Jul 30 2010

Publication series

NameKey Engineering Materials
Volume447 448
ISSN (Print)1013-9826

Other

OtherICoPE2010 and 13th ICPE International Conference on Precision Engineering
CountrySingapore
Period7/28/107/30/10

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Kitamura, K., Doi, T., Kurokawa, S., Umezaki, Y., Matsukawa, Y., Ooki, Y., ... Nakamura, Y. (2010). Basic characteristics of a simultaneous double-side CMP machine, housed in a sealed, pressure-resistance container. In Advances in Precision Engineering (pp. 61-65). (Key Engineering Materials; Vol. 447 448). https://doi.org/10.4028/www.scientific.net/KEM.447-448.61