Basic studies on tungsten-CMP slurry recycle

Takao Funakoshi, Send Ojima, Keiichirou Ishii, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi

Research output: Contribution to journalArticle

Abstract

Chemical Mechanical Polishing (CMP) system is an essential technology to produce the recent high performance electronic devices. One of the problematic point of CMP processes is its high cost. Another is its heavy load to the environment. The principal cause of these two points is that this system needs to be poured and flushed by slurry continuously. One method to solve this problem is to recycle and reuse waste slurry used in this system. This research is targeted on slurry for "Tungsten CMP" which is particularly problematic for its high cost. Untreated slurry from "Tungsten CMP" contains water and metal. These contents will degrade the processing characteristics of slurry. Examinations were conducted to ascertain if recycling waste slurry is possible by eliminating contained water and metals. It was concluded that slurry can be recycled by abstracting water by ceramic filter and metal by ion-exchange. It was also verified that this recycled slurry reserved equivalent processing characteristic as the new slurry.

Original languageEnglish
Pages (from-to)388-393
Number of pages6
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume77
Issue number4
DOIs
Publication statusPublished - Apr 2011

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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